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Amplifier IC and RF module（4）
Brand
Qorvo（4）
Encapsulation
DIE (5.7 mm x 4. 3 mm) / Wafer(1)
1.57 mm x 1.33 mm x 0.1 mm(1)
DIE (2.09 mm x 1.35 mm) / Wafer(1)
QFN-32(1)
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Pack（4）
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